Project Description
Main Features:
1, PLC control, pulse heating mode, combined with titanium alloy extrusion head, rapid heating and rapid cooling, can be set up four heating, accurate temperature control.
2, 5.7 “color touch screen LCD display input, realizing the temperature curve, according to the Chinese menu, all the parameters set browse concise and straightforward.
3, large load platform, stepper motor drive, multiple IC can be preset position, the platform automatically move the pressure to stay.
4, under the high magnification camera system, ensure that the product clearly counterpoint.
5, powerful software, perfect the system debugging, automatically detect fault and alarm function.
What Problem it Can Repair :
Vertical, horizontal, black belt, the black line, the color line, ribbons, multi-line, flower screen, black screen, white show, horizontal, vertical half and half fault, and so on.
Application: suitable for 12-65 inch TFT Panel and TAB, FPC and LCD or PCB board combination bonding.
Technical Parameters
| Item | ZM-B100 Bonding Machine | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| Operation Mode | Manually / Touch Panel | ||||||||
| Voltage/Power | 220V±10%,50/60HZ,4000W | ||||||||
| Suitable for | FPC/COF/TAB Contraposition bonded to LCD which attached ACF,Used for COF repair | ||||||||
| Bonding Precision | X±0.01MM ,Y±0.01MM | ||||||||
| FPC Size | Max:L80*W60MM Min:L10*W15MM | ||||||||
| Pressure Head Size | 50*1.5mm (Customizable) | ||||||||
| Temp Range | RT~400℃ | ||||||||
| Air Supply | 0.4~0.8MPa,Dry Air | ||||||||
| Machine Capacity | Single Indenter:28pcs/h, Double Indenter: 45pcs/h | ||||||||
| Machine Dimension | L180*W120*H140 CM | ||||||||
| Net Weight | 410KG | ||||||||
| Standard Wooden Packing | G.W: 520KG /3.5 CBM | ||||||||
