ZM-R6110 Manual BGA Rework Station

//ZM-R6110 Manual BGA Rework Station
ZM-R6110 Manual BGA Rework Station 2018-03-14T09:08:56+00:00

Project Description

ZM-R6110 BGA Rework System

  • Stable Hot Air Heating System
  • Top Heater & Placement Nozzle Split design
  • Lower Heater Adjustable
  • Carbon Fiber Infrared Pre-heater
  • High-Precision PID Temperature Control System
  • Industrial High-Definition CCD Camera(1.3MP)
  • High-Precision Optical Alignment System
  • HD Touch Screen HMI Interface
  • Manual Placement, Desoldering
  • Real-Time Temperature Monitoring and Over Temperature Protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process(Optional)


Suitable for SMD(BGA, QFP etc.) repair, support IC chips min size. 2mm * 2mm, max. 50mm * 50mm.

Technical Parameters

Operation ModeOptical /Touch Panel
Voltage/PowerAC220V 50/60HZ / Top:800W, Bottom:1200W, IR: 2700W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision2~3℃(1 Sensor Port)
Optical Alignment Precision0.025MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size: 410*375~22*22MM Chip Size: Max 50*50MM
Machine DimensionL640*W800*H850 (MM)
Net Weight75KG
Standard Wooden PackingPacking Size: L840*W880*H910(MM) / G.W: 135KG

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