ZM-R6200 Rework Station

//ZM-R6200 Rework Station
ZM-R6200 Rework Station 2018-01-25T11:37:22+00:00

Project Description

ZM-R6200 BGA Rework System

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Infrared Pre-heater
  • High-Precision PID Temperature Control System
  • Industrial High-Definition CCD Camera(1.3MP)
  • High-Precision Optical Alignment System
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Sensor System To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • SMD Feeding Device Support (Optional)

Application

Suitable for SMD(BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.

Technical Parameters

ItemZM-R6200
Operation ModeAutomatic / Optical /Touch Panel
Voltage/PowerAC220V 50/60HZ / Top:1200W, Bottom:1200W, IR: 2700W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision2~3℃(1 Sensor Port)
Optical Alignment Precision0.025MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size: 415*370~22*22MM Chip Size: 2*2MM ~ 50*50MM
Machine DimensionL640*W630*H900(MM)
Net Weight68KG
Standard Wooden PackingPacking Size: L760*W760*H1050(MM) / G.W: 120KG

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