Project Description
ZM-R6200 BGA Rework System
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Infrared Pre-heater
- High-Precision PID Temperature Control System
- Industrial High-Definition CCD Camera(1.3MP)
- High-Precision Optical Alignment System
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Sensor System To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for SMD(BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.
Technical Parameters
| Item | ZM-R6200 |
|---|---|
| Operation Mode | Automatic / Optical /Touch Panel |
| Voltage/Power | AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR: 2700W |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Temperature Precision | 2~3℃ (1 Sensor Port) |
| Preheat Zone | 280×380mm |
| Optical Alignment Precision | 0.02MM |
| CCD Magnification: | 5X~50X |
| LCD Display | 15〞720P HD LCD Display |
| For PCB Size/Chip Size | PCB Size: 415*370~22*22MM / Chip Size: 2*2MM ~ 50*50MM |
| Machine Dimension | L640*W630*H900 (MM) |
| Net Weight | 70KG |
| Standard Wooden Packing | Packing Size: L750*W700*H950(MM) / G.W: 120KG |
