Empowering EMS Giants to Achieve Zero-Defect Rework in the Era of 5G and AI Infrastructure.
The ZM-ASE2500L is a flagship, fully automated inline system designed specifically for the high-precision demands of PCBA manufacturing. Integrating non-contact induction de-soldering and high-speed solder ball placement, this equipment eliminates the risks of manual intervention, ensuring consistent quality for high-value components used in servers, telecommunications (5G), and automotive electronics.
As a high-end solution favored by Tier-1 EMS providers like Celestica, the 2500L model is engineered to handle large-scale PCBAs with unmatched efficiency and repeatability.
The non-contact single-point solder removal head, assisted by a high-precision laser displacement sensor for height measurement and a precise gravity sensor, effectively targets single-band defects in the product.
Four independent dipping arrays transfer flux from the flux supply system to the required ball placement welding positions. Four independent nozzles place solder balls at the welding positions, and laser welding is used to solidify the joints.
Equipped with three CCD vision systems, using self-developed control software to detect materials at the holes on the tray and precisely handle loading and unloading. AOI inspection is performed to accurately locate defects on the product, and ball placement nozzles are automatically calibrated after the production line changeover.
The system includes four independent preheating platforms, each equipped with a heating and temperature control system. The solder removal and ball placement of the BGA are both performed on the preheating platforms. Both the preheating platform and the solder removal head use closed-loop temperature control, ensuring stable and accurate overall temperature regulation.
| Category | ASE2500L | Specifications |
| Equipment Performance Parameters | Total Power | 5KW |
| Compatible BGA Chip Size | 27x27mm (Max); 3x3mm (Min) | |
| Tray Size | 323x136x8mm (Standard Industry Tray) | |
| Preheating Platform Temperature | ≤200°C (Adjustable) | |
| De-soldering Head Heater Temperature | ≤600°C (Adjustable) | |
| De-soldering Residue | ≤15% | |
| De-soldering Nozzle | Φ0.2-Φ1, replaceable | |
| Solder Ball Size | 0.2-0.76mm | |
| Ball Placement Accuracy | Deviation < 1/3 of ball diameter | |
| Ball Placement Nozzle | Φ0.15-Φ0.6, replaceable | |
| Production Yield | Above 95% | |
| Changeover Time | 30 minutes | |
| Ball Placement Nozzle Calibration | CCD + Tooling Sensor Calibration | |
| Dimensions | L1420xW1280xH1850mm | |
| Machine Weight | 1200KG |
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