The X-ray inspection machine uses the principle of X-ray transmission for non-destructive testing of invisible solder joints at the bottom of the package. There is no extra cost, and the detection is fast and accurate. It is widely used in electronic assembly and failure analysis. In the background of 5G, and the electronic industry with high integration, high density, packaging miniaturization, and high technology requirements, inspection skills become particularly important.
Many manufacturers are not particularly clear about the role of X-ray and how to use X-ray inspection equipment to improve the process and reduce the defect rate. SEAMARK will introduce the application advantages of the X-ray inspection machine in the following.
With the increasing application of BGA, CSP, LGA and other bottom terminal package components, visualization, SPI and AOI can no longer effectively detect their solder quality. Currently, new inspection techniques such as section analysis and dye analysis require destructive treatment of PCBA, which will undoubtedly increase the production cost. The X-ray inspection machine uses the X-ray transmission principle to perform non-destructive testing on the invisible solder joints at the bottom of the package, which does not require additional costs. The detection is fast and accurate. It has been widely used in electronic assembly and failure analysis.
There are often problems of missing solder, false solder, and incomplete solder in the process of PCB board production, which may cause abnormal work of the circuit. Also, unstable situations will bring serious threats to the debugging, use and maintenance of the circuit. Therefore, it is necessary for enterprises to avoid problems of missing solder, false solder, and incomplete solder as well as inspect correctly.
From the initial manual inspection method to the AOI inspection machine, and to the electromagnetic inspection and the current popular X-ray inspection machine, the inspection method for false solder is constantly updated. The inspection skill is constantly improving and becoming more efficient and faster. The manual inspection method is the most traditional one, it manually inspects objectives one by one. It is time-consuming and easy to miss objectives. Therefore, the manual inspection method is no longer used. The AOI inspection method is efficient and fast. However, if the PCB board is placed in the wrong position or the surface of the board is greasy, the inspection results will be greatly reduced. Electromagnetic inspection uses the resonance principle, which can inspect defective products to a large extent. However, the operation of the test bench is complicated and the details are tedious, and it is difficult to play its role without calibration. The X-ray inspection method requires the circuit board in the X-ray irradiation imaging to find blank points of false solder and incomplete solder. The operation of the software can be used for multi-position and multi-scale PCB board inspection, which is simple and easy to operate. There are advantages and disadvantages to each method, and you should choose the one that suits your business. Most companies still recognize the X-ray inspection method in terms of cost performance and effect.
X-ray inspection machine is mainly used for SMT, LED, BGA, CSP flip-chip inspection, as well as special inspection for semiconductors, packaging components, lithium electronics industry, electronic components, auto parts, aluminum die-casting, molded plastics, and ceramic products. You can consult Seamark ZM Technology Co., Ltd. about X-ray inspection information. We are a professional X-ray inspection machine manufacturer integrating R&D, production, sales and service. We have a good reputation in the industry.