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BGA Rework Station

We are now providing BGA rework Station including manual, semi-automatic, and fully automatic one for PCBA repairing; microfocus X-ray inspection machine, such as offline X-ray inspection machine, online X-ray inspection machine, 3D/CT X-ray inspection machine; Online& offline X-ray SMD reel counter and SMD smart storage systems, such as smart storage rack, smart storage tower, and smart storage warehouse. This diversified product range with reasonable price and technical support enables us to help more and more EMS companies could use higher-level automation production equipment.

Types of BGA Rework Station

ZM-R5860 Hot Air BGA Rework Station
ZM-R5860 Hot Air BGA Rework Station
Principle and Operation ModeThree-temperature zone Independently control, convection hot air heating, lower temperature zone height-adjustable, high-precision autonomous control system, high-precision
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ZM-R7220A Infrared BGA Rework Station
ZM-R7220A Infrared BGA Rework Station
ZM-R7220A is an intelligent BGA rework station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling.
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ZM-R730A Large Board BGA Rework Station
ZM-R730A Large Board BGA Rework Station
HD Optical Alignment and Intelligent ControlEquipped with automatic feeding device, using Panasonic PLC and high-precision temperature control module, high-precision K-type thermocouple, dynamic PID
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ZM-R7830A Smart Optical BGA Rework Station
ZM-R7830A Smart Optical BGA Rework Station
R7830A is an optical alignment automatic rework equipment, multi-language menu interface, automatic feeding device, X/Y axis that can be controlled by joystick, fast and convenient operation, imported...
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ZM-R7850A Smart Optical BGA Rework Station
ZM-R7850A Smart Optical BGA Rework Station
R7850A is an optical alignment automatic rework equipment, multi-functional control features, convenient temperature setting and storage, bottom heating system, smoke purification system, high-definit...
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ZM-R8650 Fully Automatic BGA Rework Station
ZM-R8650 Fully Automatic BGA Rework Station
R8650C is a fully automatic visual alignment BGA rework station, suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding.
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ZM-R8000B Large Precision Rework Station
ZM-R8000B Large Precision Rework Station
R8000B is a large-scale precision rework station, self-tuning temperature curve, large-area preheating platform, automatic feeding and adsorption, high-performance, multi-loop heating system.
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ZM-R8000D Large Precision Rework Station
ZM-R8000D Large Precision Rework Station
R8000D is an ultra-large high-end optical alignment precision rework station, suitable for rework of 5G server and large server mainboards.
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ZM-R9000 Super Large Board Disassembly Preheating Platform
ZM-R9000 Super Large Board Disassembly Preheating Platform
R9000 super large preheating platform is suitable for the rework of surface mounting devices for 5G and other large servers.
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FAQ of BGA Rework Station

How does a BGA Rework Station work?

The working principle of the BGA rework station is to use artificial intelligence (AI) technology to set a good temperature curve, and through the temperature control system, to achieve high-precision inspection and monitoring of the process of disassembly, soldering, and assembly of the BGA chip rework. The high-end BGA rework station has a visual high-definition automatic alignment system. After the PCB board and BGA, images are captured and positioned by the CCD, the image processing software analyzes and automatically corrects the deviation to achieve precise alignment and placement. The repeat placement accuracy can reach ± 0.01mm. The upper heating device and the placement head realize fully automatic identification of the placement device and placement height and have the functions of fully automatic alignment, fully automatic mounting, fully automatic soldering, and fully automatic desoldering.

What is BGA Rework Station?

The BGA rework station, as the name suggests, is a machine used to rework BGA. BGA is a sealed chip. If there is a bad BGA on the production line, this machine needs to be used for rework. The equipment adopts an integrated design of BGA device removal, placement, alignment, and soldering. It is suitable for the repair of BGA, CSP, POP, PTH, WLESP, QFN, CHIP0201/01005, shielding frames, modules, and other components on PCBA substrates such as servers, PC motherboards, tablet computers, and smart terminals.

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jackie@zhuomao.com.cn
0086-0755-29929955