The working principle of the BGA rework station is to use artificial intelligence (AI) technology to set a good temperature curve, and through the temperature control system, to achieve high-precision inspection and monitoring of the process of disassembly, soldering, and assembly of the BGA chip rework. The high-end BGA rework station has a visual high-definition automatic alignment system. After the PCB board and BGA, images are captured and positioned by the CCD, the image processing software analyzes and automatically corrects the deviation to achieve precise alignment and placement. The repeat placement accuracy can reach ± 0.01mm. The upper heating device and the placement head realize fully automatic identification of the placement device and placement height and have the functions of fully automatic alignment, fully automatic mounting, fully automatic soldering, and fully automatic desoldering.