Remove, align and replace BGA components with controlled heating and optical alignment. Choose a station for bench repair, recurring work on large boards or automated solder removal and reballing.
Support the board and use a thermal profile matched to the assembly before lifting the package.
Remove residual solder and check the pads. Reball the removed package if it will be reused and the process calls for it.
Use optical alignment to position the component on the PCB pads, then run the validated reflow and cooling profile.
Inspect the reworked area. Review hidden solder joints with X-ray where needed and run the assembly's required functional checks.
Start with your board and package sizes, the steps you need to automate, and how often the job repeats.
Use vision alignment and a programmable heating profile for component replacement and repeatable placement.
View ZM-R7830A
Combine component removal, residual solder removal and resoldering in one workstation.
View ZM-R7880
Evaluate automated removal and vision-guided placement for large server, communications and industrial boards.
View ZM-R8650C
Connect solder removal, package cleaning, solder ball placement and optical inspection in a line.
View ZQ3500Checking hidden joints after rework? Explore X-ray inspection.
Share your largest board and package dimensions, the work you need to perform, and your expected rework volume. Our team can help you select equipment and plan a sample trial.
Contact Our Team
EN
es 
ko 
de 
it 
pt 
th 
ar 
pl 
vi 
tr 
ru
