R8650C is a fully automatic visual alignment BGA rework station, suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding, and automatic desoldering. It can be combined with SAP/ERP to realize the software linkup (optional), and to realize the temperature curve sub-board with S/N as the retroactive condition.
Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high-definition industrial camera system is for accurate measurement and positioning of the chip, the automatic vision software system automatically corrects the angle, and the image is displayed in HD.
High-definition CCD (5 million pixels) and high-definition CCD (1.3 million pixels) industrial cameras can accurately detect with telecentric lenses to avoid image distortion, eliminate measurement errors, achieve accurate alignment, and repeat alignment accuracy can reach ± 0.01mm.
Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.
It adopts an industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently. It adopts a grinding marble platform and a precision grinding screw. The visual accuracy can reach ± 0.01mm.
The self-developed software system realizes fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and can automatically generate record files to achieve traceability of historical parameters. The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics, and there are Chinese and English interfaces to choose from.
Three heat zones independently programmed and controlled; convection hot air heating in the upper zone and the lower zone, the lower zone adopts a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported mediumwave ceramic infrared heating Plate heating. The area can reach 645 * 524mm.
High-definition K-type thermocouple with accuracy up to ± 1 ℃, dynamic PID multi-loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.
The bottom preheating adopts the heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.
|Power Supply||AC380V±10% 50/60HZ|
|Power||22KW(Max)，Top heater(2KW) Bottom heater (2KW)，IR Preheater (16KW), Other(2KW)|
|BGA Chip Size||100*100mm(Max);1*1mm(Min)|
|IR Heater Size||640*520mm|
|Temperature Sensor||8 Pcs|
|Control System||Industrial PC+ Servo motion control system|
|Display System||24" SD display|
|Alignment System||2 Million pixels vision alignment|
|Vacuum Adsorption||Full automatic|
|Temperature Control||K-type thermocouple ( closed-loop ), each unit independent temperature control, temperature accuracy up to ±1℃|
|Positioning||L shape + universal fixture (shaped fixture can be customized)|