Have you ever heard of a "BGA rework machine"? It may look like a high-precision instrument, but in essence, its core task is quite simple: to remove damaged chips and replace them with new ones.
So, why do we need a dedicated machine for this task? Why can't we just use a hot air gun? Of course, we can't. BGA chips (Ball Grid Array) are not ordinary surface-mount components; their solder joints are completely hidden underneath the chip, making them invisible to the naked eye. This makes rework very difficult. That's where the BGA rework machine comes into play.
Simply put, it is a professional device used to remove, align, and re-solder BGA packaged chips.
Commonly used in the repair or manufacturing process of electronic products like mobile phone motherboards, computer motherboards, and graphics cards, the BGA rework machine is used whenever a BGA chip has soldering defects, cold solder joints, system crashes, or fails to power on.
Its main functions include:
Precise Heating: To avoid damaging the motherboard or the chip.
Automatic Alignment: If the chip is misaligned, it can't be soldered properly.
Zone Temperature Control: Upper hot air, lower heating, and infrared assistance, with precise temperature control.
Integrated Disassembly and Reassembly: It can both remove the chip and re-solder it.
The "working principle" of the BGA rework machine can be broken down into three stages:
First, the chip's surrounding solder balls are heated to the melting point using bottom preheating and top hot air. Once the solder balls melt, a vacuum suction nozzle gently lifts the chip. The entire process is precise and controlled to avoid damaging the motherboard.
After the old chip is removed, the solder pads need to be cleaned, and the new chip must be aligned. The "alignment" is not done manually, but with a camera and optical alignment system, ensuring that the chip and the solder pads are perfectly aligned.
Once aligned, heating is applied again to melt the solder balls and automatically fill the gap between the solder pads and the chip. The temperature is finely controlled, generally following a standard reflow curve for heating, holding, and cooling to prevent thermal shock from damaging the components.
Because BGA chip packaging is complex, with densely packed solder joints that are hidden from view and cannot be operated on manually, it is essentially a "blind spot" for traditional soldering methods.
The BGA rework machine acts like a "microscopic surgeon", precisely controlling heat and positioning. Not only does it improve the success rate of repairs, but it also greatly reduces the risk of damage to the PCB.
Especially in the rework of motherboard chips, graphics card GPUs, or laptop north-south bridge chips, its presence is almost "essential".
The BGA rework machine is a high-precision heating device used for the disassembly and reassembly of BGA packaged chips. It features precise temperature control, automatic alignment, safety, and efficiency, making it an indispensable tool for chip-level repairs.
If you're involved in motherboard repair, laptop repairs, or electronic manufacturing, understanding the principles and applications of the BGA rework machine is the first step toward professional expertise.
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