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As the market trends for PCB functionality have increased and sizes become smaller, PCBA repair has become highly specialised and demanding. This has led the manual repairing by hot air guns being difficult, at the same time the success rate is lower. So a suitable rework station machine is essential for the repair of larger and tiny chips. The hot air output of the BGA rework station is uniform, and the heating temperature can be accurately controlled. The temperature difference of the air is controlled within 1 degree. Multi-segment curve heating is used to realize the partial reflow soldering of the PCB rework station to achieve the purpose of repair.
