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Six Considerations when Choosing BGA Rework Station Equipment

With the development of technology, in this era when BGA rework station equipment has gradually replaced air guns, we need to spend more effort when selecting BGA equipment. So what should you pay attention to when choosing this product? In response to this question, we have divided it into six points in the following content for everyone to answer.

1. Note 1: Consider from the operation control system of the BGA rework station machine

The operation control system of the machine generally includes instrument, touch screen and computer control. The operation of the instrument is too complicated, the price of the computer is relatively expensive, and the touch screen is relatively practical.

2. Note 2: Consider the chip size of the BGA rework station

Choose a machine that fits the size of the BGA chip, the bigger the better.

3. Note 3: Select BGA rework station by temperature accuracy

As we all know, temperature accuracy is the core of BGA reworker equipment, and the industry standard is plus or minus 3 degrees. The smaller the temperature difference, the better, you can use the furnace temperature tester to simulate the test.

4. Note 4: The BGA rework station equipment with the upper infrared heating can be selected

Regarding this recommendation, the main reason is that there are many types of BGAs and a wide range of classifications. To cope with various BGAs, requiring convenience, precision and high efficiency, it is recommended to use the upper infrared heating equipment.

5. Note 5: Select BGA rework station by making board area

If the board area is too small, the board cannot be preheated well, and it is easy to cause problems such as deformation, blistering, yellowing, and fault. Therefore, it is necessary to choose the board area when choosing a BGA rework station.

6. Notice 6: Temperature area of BGA rework station equipment

The applicable range of different temperature zones is also different. For example, in the three-temperature zone, the upper and lower parts of the BGA chip are locally heated, and the bottom is preheated for the whole board. For the two temperature zones, the lower temperature zone is missing, and the success rate of small or simple BGA chips is alright. For example, in the iron case package or the larger BGA chips, the two temperature zones are difficult to satisfy.

After the introduction of the above six major issues, do you have more direction when choosing bga rework machine?

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