ZM-R7220A SMD infrared BGA rework station is an intelligent IR BGA rework station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling. As an infrared soldering station manufacturer, Zhuomao promises to provide high-quality Infrared Soldering Stations. Significantly, the price of Zhuomao's infrared BGA Rework station is reasonable.
Real-time temperature display, with automatic curve analysis function.
High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.
The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame. Laminar integrated cooling fan.
As one of the top BGA Rework Station suppliers in China, Seamark ZM is famous for its rich technical force, complete detection means, reliable product quality, and full service. If you want to know the BGA repair machine and to get a perfect kind of repair machine for your factory, please contact Seamark ZM first.
|Power Supply||AC220V±10% 50/60HZ|
|Power||5.65KW(Max)，Top heater(1.45KW) Bottom heater (1.2KW)，IR Preheater (2.7KW),Other(0.3KW)|
|BGA Chip Size||60*60mm(Max);2*2mm(Min)|
|IR Heater Size||285*375mm|
|Temperature Sensor||1 pcs|
|Operation Method||7" HD touch screen|
|Control System||Autonomous heating control system V2（software copyright）|
|Display System||15" SD industrial display (720P front screen)|
|Alignment System||2 Million Pixel SD digital imaging system, automatic optical zoom with laser red-dot indicator|
|Temperature Control||K-type thermocouple closed-loop control with accuracy up to ±3℃|
|Positioning||V-groove with universal fixture|
The main difference between a hot air rework station and an IR BGA Rework Station is the way they heat the board. A hot air rework station uses heated air to transfer heat from the tool-to-board interface and into the solder balls, whereas an IR BGA Rework Station uses infrared light to heat up just enough of each ball so that it melts.
The next important difference is how they control temperature: Hot Air rework stations use PID temperature control, but IR BGA Rework Stations use proportional pressure modulation (PPM). PPM is more precise than PID because it can monitor changes in pressure within milliseconds. This means that when applying flux to a board or when reflowing solder balls on a board, you can rapidly respond by adjusting your PPM settings as necessary. With PID, this would take about 20 seconds per change due to slow response times in most systems.
Another key difference lies in airflow control systems; hot air has no need for specialized airflow since there's no need for cooling during reflow since all of that happens outside of the oven chamber using an external fan which blows across all areas equally regardless if they are close or far away from each other.