Project Description

ZM-R7220A BGA Rework System – upgrade from ZM-R6200

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Infrared Pre-heater
  • High-Precision PID Temperature Control System
  • Industrial High-Definition CCD Camera(1.3MP)
  • High-Precision Optical Alignment System
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Sensor System To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process(Optional)


Suitable for SMD(BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.

Please note: Specification are subject to change without notice!

Technical Parameters

Operation ModeAutomatic / Optical /Touch Panel
Voltage/PowerAC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR:
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision2~3℃ (1 Sensor Port)
Preheat Zone280×380mm
Optical Alignment Precision0.01MM
CCD Magnification:5X~50X
LCD Display15〞720P HD LCD Display
For PCB Size/Chip SizePCB Size: 415*370~22*22MM / Chip Size: 2*2MM ~ 50*50MM
Machine DimensionL640*W630*H900 (MM)
Net Weight79KG
Standard Wooden PackingPacking Size: L750*W700*H950(MM) / G.W: 120KG

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