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This system is primarily designed for pre-programmed Automatic Optical Inspection (AOI) of SMT component placement conditions both before and after reflow. It is equipped with a multi-angle RGB illumination system, a high-resolution industrial camera, and a telecentric lens, delivering high-definition image quality while maintaining high-speed inspection.
The S3020 2D inline AOI system is capable of detecting a wide range of defects on SMT printed circuit boards, including missing components, misalignment, polarity errors, lifted leads, side-standing, tombstoning, poor solder joints, solder balls, oxidation contamination, foreign objects, and surface scratches.
Supports offline programming; program creation and debugging do not affect production line operation.
12-megapixel high-resolution industrial camera (25-megapixel optional) delivers high-definition image quality for high-speed inspection.
Supports integration with MES systems according to factory requirements.
High-brightness RGB tri-color illumination accurately reproduces the true condition of solder, ensuring stable inspection and reducing missed defect detection.
| Model | S3020 | |
|---|---|---|
| Vision System | Imaging | 12 MP industrial camera (25 MP optional) |
| Resolution | 5μm/10μm/15μm | |
| Inspection Speed | 0.3S/FOV | |
| Illumination | RGB LED | |
| Hardware | Power Supply | 200V-230V AC 50/60Hz |
| Power Consumption | 2.2KW | |
| Air Pressure | 0.4-0.6MPa | |
| Weight | 1000KG | |
| Machine Dimensions | 1000mm（L）*1270mm（W）*1630mm（H） | |
| Inspection Specifications | PCB Size | 510*480mm |
| PCB Thickness | 0.4-6mm | |
| Edge Clearance | 3mm | |
| Top/Bottom Clearance | 45mm | |
| Conveyor Height | 900±50mm | |
| Optional Functions | Auxiliary Features | Centralized remote review, barcode reading, OCR recognition |
| Defect Detection | Missing components, misalignment, reverse polarity, side-standing, tombstoning, solder joint defects, solder balls, oxidation/contamination, foreign objects, scratches, etc. |
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