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Remote centralized review, barcode reading
SP3100 is a pre-programmed SMT solder paste printing Automatic Optical Inspection (AOI) system. It is equipped with a multi-angle RGBW illumination system, dual low-angle projection modules, a high-resolution industrial camera with a telecentric lens, and a high-precision automatic Z-axis module.
The system scans solder paste on the PCB surface using combined 2D + 3D inspection. By applying phase-shift technology, it generates three-dimensional contour data, enabling accurate measurement of solder paste height, volume, and area with micron-level precision, even under complex process conditions.
SP3100 delivers high-accuracy 3D automated inspection and can effectively detect defects such as excess solder, insufficient solder, missing print, solder bridging, exposed copper, and positional offset.
High-precision 3D imaging technology with a dual low-angle projection system effectively minimizes shadowing and occlusion in fine-pitch components.
Equipped with a 12-megapixel high-resolution industrial camera (optional 21-megapixel), delivering high-clarity images to support high-speed inspection.
Supports integration with MES systems according to factory requirements.
Powerful SPC software provides comprehensive and precise statistical data analysis.
| Model | SP3100 | |
|---|---|---|
| Vision System | Imaging | 12MP industrial camera (21MP optional) |
| Resolution | 5μm/10μm/15μm | |
| Inspection Speed | 8.6c㎡/s 34.3c㎡/s 77.1c㎡/s | |
| Illumination | RGBW LED | |
| Hardware | Power Supply | 200V-230V AC 50/60Hz |
| Power Consumption | 2.2KW | |
| Air Pressure | 0.4-0.6MPa | |
| Weight | 1300KG | |
| Machine Dimensions | 1100mm（L）*1350mm（W）*1630mm（H） | |
| Inspection Specifications | PCB Size | 510*460mm |
| PCB Thickness | 0.4-6mm | |
| Edge Clearance | 3mm | |
| PCB Clearance (Top/Bottom) | 45mm | |
| Conveyor Height | 900±50mm | |
| Measurement Height | Components up to 2 mm in height | |
| Defect Detection | Excess solder, insufficient solder, missing print, bridging, exposed copper, offset, etc. | |
| Data Statistics & Analysis | Statistical Charts & Reports | Histogram, X-bar R/S charts, Cp/Cpk display, repeatability and reproducibility (R&R), daily/weekly/monthly/annual yield analysis |
| Optional Functions | Auxiliary Features | Remote centralized review, barcode reading |
_System.webp "S3020 2D Automatic Optical Inspection (AOI) System")
