X6600B is a 6-axis universal offline precision micro-focus X-ray inspection equipment. It has the characteristics of high magnification, multi-angle,and large-area inspection platform. At the same time, it has one-button door opening and closing,and real-time monitoring of radiation conditions around the equipment to ensure the safety of the environment and operators. Ideal for detecting BGA voids, Head-in-Pillow (HIP), QFN solder bridging, and IGBT wire bonding defects.
Fingerprint authentication authorizes designated personnel to operate the system
The X and Y axes of the stage adopt high-precision ball screw drive systems, ensuring inspection accuracy
When standard vertical inspection cannot meet requirements, the T-axis tilt inspection function can be used to achieve more comprehensive inspection coverage
Real-time radiation level monitoring with multiple safeguards to ensure operator safety
| Model | X6600B | |
|---|---|---|
| X-ray Tube | Tube Type | Reflection sealed microfocus X-ray source |
| Tube Voltage Range | 40-130KV | |
| Tube Current Range | 10-300μA | |
| Maximum Output Power | 39W | |
| Microfocus Spot Size | 5 μm (at 4 W) – 40 μm | |
| Flat Panel Detector | Flat Panel Type | Amorphous Silicon Flat Panel Detector |
| Pixel Matrix | 1536×1536 | |
| Field of View | 130mm×130mm | |
| Resolution | 5.5Lp/mm | |
| Image Frame Rate (1×1) | 20fps | |
| A/D Conversion | 16bits | |
| System Specifications | Dimensions | L1380xW1425xH1951mm |
| Input Power | 220V 10A 50-60HZ | |
| Maximum Sample Size | 620mm×620mm | |
| Operation System | Industrial PC, Windows 10 (64-bit) | |
| Net Weight | 1800KG |
A: The X6600B accommodates a large inspection area with a maximum sample size of 620mm x 620mm. It features a 130mm x 130mm Field of View (FOV) and supports multi-angle inspection for various PCBA sizes.
A: Yes, the X6600B is specifically designed for high-precision inspection of IGBT modules, BGA, CSP, QFN, and LED components. It effectively detects defects such as BGA voids, cold solder joints, head-in-pillow (HIP), and wire bonding breaks.
A: Yes, the machine features a CNC programming mode. This allows operators to set multi-point coordinate arrays for automatic batch inspection, significantly improving efficiency for mass production lines.
A: The X6600B is equipped with a micro-focus X-ray tube with a spot size as small as 5μm (at 4W) and a flat panel detector resolution of 5.8Lp/mm, ensuring clear imaging of minute defects.
A: Yes, the intelligent inspection software includes an Automatic Void Ratio Calculation function. It can automatically identify BGA soldering balls and calculate the void percentage, generating a detailed quality report.
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