Project Description

BGA Rework Station ZM-R5860

  • Entry Level BGA Rework Ststion
  • Stable Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Infrared Pre-heater
  • HD Touch Screen HMI Interface
  • Manual Placement, Desoldering
  • More modular panels observation point setting
  • Real-time temperature monitoring and over heating protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process(Optional)


Suitable for SMD(BGA, QFP etc.) repair, support IC chips min size. 2mm * 2mm, max. 50mm * 50mm.

Please note: Specification are subject to change without notice!

Technical Parameters

Operation ModeManually /Touch Panel
Voltage/PowerAC220V±10 50/60HZ / Top 800W,Bottom 1200W,Infrared 2700W
Heating ModeTop nozzle/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision 3~5℃
PCB Size/Chip SizeMax 410×370 mm Min 20×20 mm Chip: 2*2~80*80MM
Machine DimensionL630*W610*H690
Net Weight45KG
Standard Wooden PackingPacking Size: L640*W690*H720(MM) / G.W: 75KG

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