Project Description
BGA Rework Station ZM-R5860
- Entry Level BGA Rework Ststion
- Stable Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Infrared Pre-heater
- HD Touch Screen HMI Interface
- Manual Placement, Desoldering
- More modular panels observation point setting
- Real-time temperature monitoring and over heating protection.
- Emergency Stop Function
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for SMD(BGA, QFP etc.) repair, support IC chips min size. 2mm * 2mm, max. 50mm * 50mm.
Please note: Specification are subject to change without notice!
Technical Parameters
| Item | ZM-R5860C | ||
|---|---|---|---|
| Operation Mode | Manually /Touch Panel | ||
| Voltage/Power | AC220V±10 50/60HZ / Top 800W,Bottom 1200W,Infrared 2700W | ||
| Heating Mode | Top nozzle/Bottom Nozzle Hot Air, Bottom Plates Infrared | ||
| Temperature Precision | 3~5℃ | ||
| PCB Size/Chip Size | Max 410×370 mm Min 20×20 mm Chip: 2*2~80*80MM | ||
| Machine Dimension | L630*W610*H690 | ||
| Net Weight | 45KG | ||
| Standard Wooden Packing | Packing Size: L640*W690*H720(MM) / G.W: 75KG | ||
