As electronics manufacturing continues moving toward high-density integration, detecting internal defects in advanced packages such as BGA, CSP, and QFN has become increasingly challenging. Traditional 2D X-ray systems are limited by overlapping structures, making it difficult to identify hidden solder joint defects. Meanwhile, conventional CT systems often fail to meet production demands due to slow inspection speeds.
The Seamark AXI9000 High-Speed CT X-ray Fully Automatic Inspection System addresses these challenges by combining high speed, high precision, and intelligent automation, delivering a reliable solution for modern electronics inspection.
The AXI9000 features a three-layer gantry structure driven by linear motors and high-precision grating scale positioning, ensuring stable and high-speed operation.
With advanced 3D/CT reconstruction technology, the system achieves inspection speeds of up to 2 seconds per FOV, significantly improving throughput. Users can flexibly adjust projection counts and resolution settings to balance speed and accuracy based on different production requirements.
Equipped with a 16-bit high-precision flat panel detector, the AXI9000 delivers a resolution of 5.0 Lp/mm, with an optional 3μm CT resolution for enhanced detail.
This enables clear visualization of micro-defects, including:
BGA solder ball voids
QFN package cracks
Internal structural defects
The system also integrates a self-developed “Height H” positioning algorithm and AI super-resolution fusion technology, which automatically compensates for PCB warpage. This ensures accurate detection of complex defects such as:
Cold solder joints
Head-in-Pillow (HiP)
Insufficient solder filling in DIP components
The AXI9000 supports a wide range of inspection requirements:
PCB size: 50 × 50 mm to 610 × 510 mm
Thickness: 0.5 mm to 10 mm
It is suitable for various applications, including:
Semiconductor packaging (Flip-chip, PoP)
Automotive electronics
Communication PCBs
From BGA and CSP to IGBT and DIP components, the system adapts to diverse inspection scenarios with a single platform.
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Powered by a high-performance GPU image processing workstation and proprietary software, the AXI9000 supports:
Automatic parameter configuration
Reduced operator dependency
Consistent inspection results
Additional features include:
Remote control capability
Data traceability and archiving
Real-time quality monitoring
These functions support digitalized production and improve overall process control.
The AXI9000 is designed with strict safety standards:
Radiation leakage: <0.5 μSv/hr
Multiple safety interlock systems
This ensures safe operation while supporting 24/7 continuous production environments.
From high-speed CT scanning to intelligent defect analysis, the Seamark AXI9000 sets a new standard in electronics inspection. It helps manufacturers improve both quality control and production efficiency, meeting the demands of next-generation electronics manufacturing.
Learn more about the product:
Seamark AXI9000 High-Speed CT X-Ray Fully Automatic Inspection System
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