Project Description

ZM-R730A Rework System – for Large Size PCB

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable(Height Moving Range 3CM)
  • Ceramic honeycomb Infrared Preheater(Left/ Right Moving Range 30 CM)
  • High-Precision PID Temperature Control System(5 K-type sensor, 10 temperature zone control )
  • High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Testing Device To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process(Optional)


Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Max. 80mm x 80mm, Min. 0.5mm * 0.5mm IC. PCB motherboard support Max. 620mm x 520mm

Please note: Specification are subject to change without notice!

Technical Parameters

Operation ModeHigh Automatic / Optical /Touch Panel
Voltage/PowerAC 380V±10% 50/60HZ / Top:1200W, Bottom:1200W, IR: 4800W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision2-3 ℃(5 Sensor Port)
Preheat Zone420×435mm
Optical Alignment Precision0.01MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size: 6*6MM~645*520MM / Chip Size: 3*3~80*80MM
Machine DimensionL1000*W840*H950(MM)
Net Weight128KG
Standard Wooden PackingPacking Size: L1100*W950*H1050(MM) / G.W: 180KG

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