ZM-R730 Rework System – for Large Size PCB

//ZM-R730 Rework System – for Large Size PCB
ZM-R730 Rework System – for Large Size PCB 2018-04-17T18:01:57+00:00

Project Description

ZM-R730 Rework System – for Large Size PCB

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable(Height Moving Range 3CM)
  • Ceramic honeycomb Infrared Preheater(Left/ Right Moving Range 30 CM)
  • High-Precision PID Temperature Control System(5 K-type sensor, 10 temperature zone control )
  • High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Testing Device To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process(Optional)

Application

Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Max. 80mm x 80mm, Min. 0.5mm * 0.5mm IC. PCB motherboard support Max. 620mm x 520mm

Technical Parameters

ItemZM-R730
Operation ModeHigh Automatic / Optical /Touch Panel
Voltage/PowerAC 380V/AC220V 50/60HZ / Top:1200W, Bottom:1200W, IR: 4800W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision2-3 ℃(5 Sensor Port)
Optical Alignment Precision0.02MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size:10*10MM~620*520MM Chip Size:0.5*0.5~50*50MM
Machine DimensionL833*W905*H933(MM)
Net Weight100KG
Standard Wooden PackingPacking Size: L910*W800*H1100(MM) / G.W: 150KG

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