Xray Inspection System Introduce
2D X-ray, 2.5D X-ray, 3D X-ray, Real-time X-ray, X-ray Microscope, Cabinet X-Ray Systems, Closed X-Ray Systems, Industrial X-ray Systems.
X-ray inspection is a powerful non-destructive technique that provides detailed information about the internal structure of a component or material without taking it apart. The x-ray imaging method is real-time that provides images instantly without film and provides the result as a digital image. In addition, the 2D x-ray system has the ability to move the sample and rotate it to inspect at a variety of angles and perspectives during a single inspection, 3D X-ray system could provide 3D instructure by 360° rotating sample.
How X-rays system works
X-rays penetrate most components easily but are affected by the density of the materials. So It results in shadow on the detector clearly showing the outlines of all internal features of the sample.
A higher voltage of X-ray source helps to provide more penetration performance, lower microns source helps to get more clear outlines. But the ultimate resolution of the x-ray image also affected by the detectors size and pixels.
Non-destructive inspection of Printed circuit board assemblies (PCBAs) and related semicon components (harness connectors, cables, ICs, BGAs, FPGAs, resistors, capacitors, sensors etc), Lithium batteries.
Sample size support 18x 18 inches and weight up to 20 pounds. Sample preparation is normally not required for x-ray inspection, just need put in on the inspection table. In some situations, the case or other hardware should be removed to improve visibility of the desired parts.
Images can be provided as BMP, JPG, PNG or similar and are most frequently included in a formal report. Image processing is also available on this system for improved contrast and detail.
Non-destructive techniques are critical for inspection on product that is planned for shipping as well as suspect parts where the failure mode must not be impacted. X-ray is helpful in identifying the many defects including the following examples:
Solder defects like BGA Voids, Cracks, Poor Hole Fill.
Wire bond defects like broken, missing, shorted, shifted wire.
PCB inner layer cracks, shorts and alignment
X-ray is a good choice for most of electronic materials, but it’s not a good choice for very thin or low density materials such as organic products.