Project Description

X-Ray inspection system X7600

  • SMT/Semicon/Solar/Connector/LED
  • High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
  • 90KV 15μm (130 KV Optional)closed X-ray tube,long life time,maintenance in free
  • 2.3 mllion high resolution digital flat panel detector
  • 6 axis linkage system.
  • 60 degrees observation
  • Platform 360° rotation
  • Color lmage Navigation & Mapping Navigation
  • Mapping Mosaic Function. (optional )
  • Scalable 3D module (Industrial CT Optional)
  • Programmable Detection. (Optional )


1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

8) Seed, biological material inspection etc.

Technical Parameters

Items Contents
X-RAY launch tubeTube typeClosed X-ray tube
Maximum tube voltage90kV (100, 130 KV Optional)
Maximum tube current0.15mA
Focal spot size15μm
MagnificationGeometric magnification:200X
System magnification:1000X
DetectorImage speed35 fps
Inclined AngleTable 360° RotationDetector 60°
Cabinet SpecificationsStage size500mm*500mm
DimensionLength: 1630mm, width: 1850mm, height: 1650mm
Net weight1600kg
Input voltageAC 110-220V (+10%) (international standard power supply)
X-ray leakage amount≤1 u Sv/hr
Operating systemWindows 7 Seamark3.0
Total power2500W

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