ZM-R6823 Rework Station-Nitrogen Capacity

//ZM-R6823 Rework Station-Nitrogen Capacity
ZM-R6823 Rework Station-Nitrogen Capacity 2018-03-14T09:09:24+00:00

Project Description

ZM-R6823 BGA Rework System

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Micro-crystalline Infrared Preheater
  • External Air (N2) Supply Control System
  • High-Precision PID Temperature Control System
  • Automatically High-Precision Optical Alignment System
  • Industrial High-Definition CCD (2.0 MP)
  • HD Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Testing Device To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection
  • Emergency Stop Function
  • SMD Feeding Device Support (Optional)
  • Add a side camera, more clearly observe the rework process(Optional)

Application

Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.

Technical Parameters

ItemZM-R6823
Operation ModeHigh Automatic / Optical / Laser / Touch Screen
Voltage/PowerAC380V 50/60HZ / Top:1200W, Bottom:1200W, IR: 2700W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
MaterialServo Drive( Panasonic)+8” Touch Screen+PLC (Panasonic)
PCBA PositioningUniversal Fixture + Laser Positioning
Temperature Precision2~3℃(5 Sensor Port)
Optical Alignment Precision0.01MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size: 640*520~10*10MM Chip Size: 1*1~80*80MM
Machine DimensionL840*W960*H950(MM)
Net Weight100KG
Standard Wooden PackingPacking Size: L1150*W1080*H1100(MM)/ G.W: 200KG

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