Project Description

ZM-R7830A BGA Rework System – Upgrade from ZM-R6823

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Micro-crystalline Infrared Preheater
  • External Air (N2) Supply Control System
  • High-Precision PID Temperature Control System
  • Automatically High-Precision Optical Alignment System
  • Industrial High-Definition CCD (2.0 MP)
  • HD Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Testing Device To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection
  • Emergency Stop Function
  • SMD Feeding Device Support (Optional)
  • Add a side camera, more clearly observe the rework process(Optional)


Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.

Please note: Specification are subject to change without notice!

Technical Parameters

Operation ModeHigh Automatic / Optical / Laser / Touch Screen
Voltage/PowerAC 380V, 50/60HZ / Top:1000W, Bottom:1200W, IR: 4000W
Heating ModeTop/Bottom Nozzle Hot Air, Bottom Plates Infrared
Preheating area sizeL380mm×W500mm
MaterialServo Drive( Panasonic)+8” Touch Screen+PLC (Panasonic)
PCBA PositioningUniversal Fixture + Laser Positioning
Temperature Precision±1℃, K-type thermocouple (Closed Loop, 6 Sensor Port)
Optical Alignment Precision0.01MM
CCD Magnification:5X~50X
For PCB Size/Chip SizePCB Size: 560*470~10*10MM Chip Size: 1*1~80*80MM
Machine DimensionL760*W850*H950(MM)
Net Weight150KG
Standard Wooden PackingPacking Size: L1150*W1250*H1350(MM)/ G.W: 205KG

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