Project Description
ZM-R7830A BGA Rework System – Upgrade from ZM-R6823
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- External Air (N2) Supply Control System
- High-Precision PID Temperature Control System
- Automatically High-Precision Optical Alignment System
- Industrial High-Definition CCD (2.0 MP)
- HD Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection
- Emergency Stop Function
- SMD Feeding Device Support (Optional)
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.
Technical Parameters
| Item | ZM-R7830A |
|---|---|
| Operation Mode | High Automatic / Optical / Laser / Touch Screen |
| Voltage/Power | AC 380V, 50/60HZ / Top:1000W, Bottom:1200W, IR: 4000W |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Preheating area size | L380mm×W500mm |
| Material | Servo Drive( Panasonic)＋8” Touch Screen＋PLC (Panasonic) |
| PCBA Positioning | Universal Fixture + Laser Positioning |
| Temperature Precision | ±1℃, K-type thermocouple (Closed Loop, 6 Sensor Port) |
| Optical Alignment Precision | 0.01MM |
| CCD Magnification: | 5X~50X |
| For PCB Size/Chip Size | PCB Size: 560*470~10*10MM Chip Size: 1*1~80*80MM |
| Machine Dimension | L760*W850*H950(MM) |
| Net Weight | 150KG |
| Standard Wooden Packing | Packing Size: L1150*W1250*H1350(MM)/ G.W: 205KG |
