Project Description

ZM-R8650C BGA Rework System

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Extreme Large Carbon Fiber Infrared Pre-heater
  • High-Precision PID Temperature Control System
  • Industrial High-Definition CCD (2 x 5.0 MP)
  • PC Control Automatic Image Recognition System
  • Full Automatic Placement, Desoldering
  • Built-In Pressure Testing Device To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • SMD Feeding Device Support (Optional)


Suitable for Normal SMD(BGA, QFP etc.)Repair, Support Min. SMD Size 10mm * 10mm.

Please note: Specification are subject to change without notice!

Technical Parameters

Total Power16400W
Top Heater1200W
Bottom Heater1200W
IR Heater12000W
Pre-heating Area720×600mm
PowerAC380V±10% 50/60Hz
Dimensions1350×1300×1780mm (LCD Stand Not Included)
PositioningV-Groove PCB Support, And With External Universal Fixture
Temperature ControlK-Type Thermocouple (Closed Loop), Independent Heating, Temperature Precision With in ±1℃
PCB SizeMax 580×560mm ; Min 10*10 mm
Electrical MaterialsServo Drive( Panasonic)+Industrial Host+ Heating Plate(from Ireland)
Feeding DeviceFull Automatic
Optical SystemServo Drive+ Automatic Vision Alignment System (Panasonic)+ PC
BGA Chip6*6-100*100mm
Mounting Accuracy± 0.01
Sensor PortFive
Work ModeComputer Operation
Placement AccuracyX, Y Axis And The R Angle With Micrometer Adjust, Servo Drive, Accuracy Within ± 0.01MM
Net Weight660kg

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