R8650C fully automatic BGA rework station is a fully automatic visual alignment BGA rework station. This BGA repair station can be used as an automated desoldering machine and is suitable for automatic visual placement of various chip devices on large PCB boards (such as 5G communication boards), automatic welding, and automatic PCB soldering station. This automatic SMD soldering rework station machine can be combined with SAP/ERP to realize the software linkup (optional), and to realize the temperature curve sub-board with S/N as the retroactive condition.
As a responsible BGA rework station supplier in China, Seamark promises to provide our best Automatic Soldering Machine at a reasonable price.
Two sets of high-definition industrial cameras are used, and the repeat placement accuracy reaches ± 0.01mm. The 5 million pixels high-definition industrial camera system is for accurate measurement and positioning of the chip, the automatic vision software system automatically corrects the angle, and the image is displayed in HD.
High-definition CCD (5 million pixels) and high-definition CCD (1.3 million pixels) industrial cameras can accurately detect with telecentric lenses to avoid image distortion, eliminate measurement errors, achieve accurate alignment, and repeat alignment accuracy can reach ± 0.01mm.
Equipped with ionizer, which effectively eliminates static electricity on the board and protects the product.
It adopts an industrial PC and servo motion control system to accurately control the X/Y/Z four-axis gantry structure to operate fully automatically and independently. It adopts a grinding marble platform and a precision grinding screw. The visual accuracy can reach ± 0.01mm.
The self-developed software system realizes fast positioning and stable temperature curve (with curve analysis function), easy operation and setting, and can automatically generate record files to achieve traceability of historical parameters. The operation interface is simple and fast, and a professional operation interface (system parameter setting, working mode setting, heating parameter setting, data recording, etc.) is set for different product characteristics, and there are Chinese and English interfaces to choose from.
Three heat zones independently programmed and controlled; convection hot air heating in the upper zone and the lower zone, the lower zone adopts a large area heating wire layout, suitable for the repair of larger BGA, and the infrared preheating zone uses the German imported mediumwave ceramic infrared heating Plate heating. The area can reach 645 * 524mm.
High-definition K-type thermocouple with accuracy up to ± 1 ℃, dynamic PID multi-loop closed control selective reflow soldering process. With intelligent temperature compensation, and automatic memory function.
The bottom preheating adopts the heating plate imported from Germany, and the built-in temperature measuring probe is more accurate, which effectively solves the heating temperature control effect. The bottom moving temperature zone automatically moves with the head to improve the board rework efficiency.
As one of the top BGA Rework Station suppliers in China, Seamark ZM is famous for its rich technical force, complete detection means, reliable product quality, full service. If you want to know the automatic BGA rework station and to get a perfect kind of repair machine for your factory, please contact Seamark ZM first.
| Power Supply | AC380V±10% 50/60HZ |
| Power | 22KW(Max)，Top heater(2KW) Bottom heater (2KW)，IR Preheater (16KW), Other(2KW) |
| PCB Size | 660*600mm(Max);10*10mm(Min) |
| BGA Chip Size | 100*100mm(Max);1*1mm(Min) |
| IR Heater Size | 640*520mm |
| Motion Control | X/Y/Z |
| Temperature Sensor | 8 Pcs |
| Control System | Industrial PC+ Servo motion control system |
| Display System | 24" SD display |
| Alignment System | 2 Million pixels vision alignment |
| Vacuum Adsorption | Full automatic |
| Alignment Accuracy | ±0.025mm |
| Temperature Control | K-type thermocouple ( closed-loop ), each unit independent temperature control, temperature accuracy up to ±1℃ |
| Feeding Device | Semi-automatic |
| Positioning | L shape + universal fixture (shaped fixture can be customized) |
| Dimensions | L1235*W1215*H1850mm |
| Weight | 660KG |
Seamark ZM R8650C is equipped with a 2-megapixel high-definition vision system and a precision servo platform, achieving micron-level alignment accuracy of 0.025 mm. From recognition and positioning to component placement and soldering/removal, the entire process is fully automated, eliminating reliance on operator experience or manual skill. Even beginners can easily achieve perfect chip alignment, significantly improving rework efficiency and first-pass success rate.
The system integrates upper, lower, and preheating zones, each independently controlled by a K-type thermocouple in a closed-loop system, achieving a temperature control accuracy of ±1°C. It can precisely simulate reflow soldering profiles, providing optimal thermal distribution for chips and PCBs of various sizes, effectively preventing thermal damage and ensuring reliable solder connections.
Seamark ZM R8650C supports PCB sizes up to 660×600mm, with an IR heating zone covering 640×520mm, providing ample rework space for large industrial control boards, server motherboards, and 5G base station boards. Equipped with 8 temperature measurement interfaces, it can record and analyze complete temperature profiles in real time, enabling standardized process parameter management and full data traceability throughout the rework process.
The system supports rework of components ranging from ultra-small devices as small as 1 × 1 mm to large modules up to 100 × 100 mm.
It is equipped with a fully automatic vacuum pick-and-place system, enabling precise component pickup, transfer, and placement.
The entire process is smooth, stable, and highly reliable, effectively eliminating the low efficiency, poor consistency, and risk of physical damage to components associated with manual handling.
This automation not only reduces labor dependency but also ensures the safety and integrity of high-value electronic components.
The Seamark ZM R8650C features a full ESD-protection design and is equipped with an integrated ionizing air blower.
Before operation, it effectively neutralizes electrostatic charges on PCBs and electronic components, providing comprehensive protection for high-value BGA chips and printed circuit boards.
This all-round ESD control significantly reduces the risk of electrostatic damage and improves overall process reliability.
The equipment is equipped with L-shaped slots and universal fixtures, and supports customization for irregular shapes, enabling fast changeover and stable fixation of various PCBs. Combined with a 16 kW bottom preheating zone, it provides sufficient and uniform bottom thermal compensation, rapidly raising the overall PCB temperature and ensuring that solder joints on large ground planes can fully reach reflow temperature, effectively eliminating cold solder joints.
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