Project Description

PCB X-Ray inspection system X5600

  • Miniaturized equipment, easy to install and operate
  • Applicable to Chip, LED, BGA/CSR Wafer, SOP/QFN, SMT and PTU packaging, Sensors, Connectors, and Precision Castings inspection.
  • High resolution design to get the best image in a very short time.
  • Infrared automatic navigation and positioning function can select the shooting location quickly.
  • CNC inspection mode which can quickly and automatically inspect multi-point array.
  • Inclined multi-angle inspection makes it easier to inspect sample defects.
  • Simple softwareoperation, low operating costs
  • Long lifespan


1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

8) Seed, biological material inspection etc.

Please note: Specification are subject to change without notice!

Technical Parameters

Items Contents
X-RAY launch tubeTube typeClosed X-ray tube
Tube voltage40 - 90kV
Maximum tube current10 - 200 μA
Focal spot size15μm
MagnificationGeometric magnification:150X
System magnification:800X
DetectorImage speed20 -40 fps
Pixel Matrix768x768px - 1536x1536px
Field of View65x65 - 130x130mm
Cabinet SpecificationsTable size/Max Sample Size280mm*320mm
DimensionLength: 850mm, width: 1000mm, height: 1700mm
Net weight750kg
Input voltageAC 110-220V (+10%) (international standard power supply)
X-ray leakage amount≤0.3 u Sv/hr
Control SystemIndustrial PC WIN10 64bits
Total power1500W

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    Enhanced BGA Inspection Function

    Automatic Void Ratio Calculation

    X5600 can quickly select and mark a single solder ball, or select the solder balls to be inspected by matrix box;it can manually or automatically identify BGA solder balls and complete the inspection. Follow the system guidelines to easily complete the inspection process and ensure accurate and reliable inspection results.

    Advanced Measuring and Defect Detection Tool

    ■Automatically detect defects
    X5600 can automatically detect size, area, broken wire, bridging etc.

    ■Customize image algorithm
    Customize software algorithms based on product features and request to achieve fully automatic defect inspection algorithms, including Y/N, crack, broken wire, offset, size, and quantity etc.

    ■ Measuring tools
    Distance, distance ratio, lines distance, angle, arrow mark, circle radius, points distance, circle centers distance, circumference, hand-drawn polygon, hand-drawn freeform etc., can add text description.

    CNC Inspection

    ■CNC automatic operation inspection
    X5600 support CNC multi-point automatic
    inspection mode, based on product feature set multi-point coordinates for automatic inspection.

    ■Automatic CNC operation detection
    Automatically save images, generate reports, also
    support batch inspection.

    Tilt/Rotate Function

    ■Tilt angle inspection function
    The X5600 detector support a tilt angle of ±30°. For cases where the photo taken on the front of a special device cannot identify the defect feature, the tilt function can be used to observe the device features at multiple angles, making it easier to analyze and identify the defect.

    ■360°Rotating photo inspection function
    Equipped with a rotating manipulator that can rotate 360 degrees to take images, no dead angle for defects observation.