BGA rework can expose a moisture-sensitive package to another reflow-level thermal cycle, even after the board has operated successfully for years. Moisture absorbed during storage or service can crea...
BGA rework equipment can process some shielded assemblies successfully, but only when access, heat flow and restoration of the shielding are planned together. A metal shield may block the nozzle or pi...
A controlled reballing process starts with the package specification, not with the stencil that happens to be available. Ball diameter determines solder volume, pitch defines the spacing between locat...
Missing and double solder balls in an automatic BGA reballing machine should be investigated at the stage where they first appear. A vacant location before reflow suggests a placement or retention pro...
Accurate incoming inspection is essential for electronics manufacturers that rely on a stable supply of surface-mount components. When component reels arrive at a warehouse, the quantities recorded on...
Choosing an X-ray reel counter is an important decision for electronics manufacturers that need reliable component inventory management. Although equipment specifications can provide an initial compar...
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