Use 3D computed tomography (CT) to locate features inside electronic assemblies and packages. Reconstructed slices help engineers find the depth of an indication and examine regions where features overlap in a projection.
Use 2D X-ray when the target is clear in a projection. Try angled views for added separation. Evaluate CT when you need depth information, a cross-section through a specific feature, or a volume measurement.
Evaluate AXI9000 for automated inspection of defined features on production boards. Measure the full board cycle with your inspection recipe and number of fields of view.
Use XCT8500 to evaluate reconstructed slices or volumes for complex boards, IC packages, and power modules. Define the smallest feature and the report output before the trial.
Share the sample dimensions, target feature, region of interest, and the images or measurements you need.
EN
es 
ko 
de 
it 
pt 
th 
ar 
pl 
vi 
tr 
ru
