Use X-ray imaging to inspect solder joints beneath components on assembled circuit boards. Choose offline equipment for sampling and troubleshooting, or inline equipment for automated production inspection.
Inspect BGA and QFN connections for indications such as voiding or solder bridges. For plated through-holes, assess solder fill at the points that matter to your assembly.
Use the X5600 or X6600B to inspect selected joints during new-product trials, spot checks, and process investigations. Establish views and acceptance criteria with representative boards.
Evaluate the XL6500F when automated inspection needs to fit the production line. Confirm board handling, inspection points, pass/fail criteria, and cycle time on your samples.
Share your board dimensions, package types, target defects, and production takt time.
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