Look inside packaged ICs to investigate wire bonds, die attach, and internal connections. Choose the imaging method based on the target feature, package construction, and amount of structural overlap.
Define the feature to examine, such as wire sweep or voiding in the die-attach layer. Compare representative good and suspect packages to establish a repeatable inspection view.
Use multi-angle imaging on the X7600B to investigate selected features in packages. Confirm the view and image quality on the actual package before setting acceptance criteria.
Evaluate the XCT8500 when overlapping features make a projection difficult to interpret or when you need to locate a feature within the package.
Share your package type, dimensions, target feature size, and what you need to learn from the inspection.
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