Use inline 3D/CT when you need to inspect automotive electronic assemblies in the production flow, at production speed, with repeatable, automated defect detection. Use offline 3D/CT when you need laboratory or process analysis on a sample, a failed part, or a new design. For Seamark, the inline system in this category is the AXI9000; offline work is handled by systems such as the XCT8500. Do not treat an offline CT machine as if it were an inline production system.
Automotive electronics such as control units and power modules contain hidden solder joints and stacked structures that a 2D image may not separate clearly. The AXI9000 is a high-speed, fully automatic CT X-ray inspection system for electronics. It inspects packages and components including BGA, PoP, LGA, QFP, CSP, chip, QFN, DIP through-hole devices, and IGBT.
On the official specification, inspection can be as fast as less than 2 seconds per field of view, with a flexible combination of projection count and resolution. That figure is a per-FOV speed, not a parts-per-minute rate. In-house intelligent inspection algorithms are used to detect defects such as missing components, misalignment, solder bridging, open joints, insufficient solder, voids, HIP, and DIP fill-rate issues, and the system can set inspection parameters automatically. The English product page also describes remote control, data traceability, and real-time quality monitoring.
AXI9000 is designed around PCB assemblies, with a board size range of 50 × 50 mm to 610 × 510 mm. For IGBT and SiC power modules, see the existing application page on 3D CT inspection of IGBT and SiC modules.
Offline CT is the better choice when the task is analysis rather than in-line screening: verifying a new package, measuring a hidden structure, or studying a defect in 3D after a line stop. The XCT8500 is an offline universal industrial X-ray system that supports 2D, 3D, and CT methods for quality inspection, 3D measurement, and non-destructive analysis, including electronic soldering, semiconductor packages, and IGBT modules. It is not an inline production system.
If the goal is to catch hidden solder and structural defects during automotive-electronics production, evaluate inline 3D/CT, starting with AXI9000 and a representative board or module. If the goal is failure analysis, process development, or laboratory measurement, use offline CT.
No. Inline systems are set up for production inspection of known assemblies. Offline CT remains the method for deeper analysis, new-product evaluation, and parts that are not running on a production recipe.
The official figure is inspection as fast as less than 2 seconds per field of view. Projection count and resolution can be adjusted. Actual cycle time depends on the product and should be measured on a sample.
Yes. IGBT is listed among AXI9000 inspection applications, and there is a dedicated application page for 3D CT inspection of IGBT and SiC power modules.
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